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Electronic device packages with conformal EMI shielding and related methods |
Joshua D. Heppner, Rajendra C. Dias, Mitul Modi |
2017-12-19 |
| 9842818 |
Variable ball height on ball grid array packages by solder paste transfer |
Jimin Yao, Shawna M. Liff |
2017-12-12 |
| 9741692 |
Methods to form high density through-mold interconnections |
Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Debendra Mallik, Bassam M. Ziadeh |
2017-08-22 |
| 9685413 |
Semiconductor package having an EMI shielding layer |
Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner +2 more |
2017-06-20 |
| 9659899 |
Die warpage control for thin die assembly |
Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Nitin A. Deshpande +2 more |
2017-05-23 |
| 9607964 |
Method and materials for warpage thermal and interconnect solutions |
Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar |
2017-03-28 |