Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Joshua D. Heppner, Rajendra C. Dias, Mitul Modi | 2017-12-19 |
| 9842818 | Variable ball height on ball grid array packages by solder paste transfer | Jimin Yao, Shawna M. Liff | 2017-12-12 |
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| 9685413 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner +2 more | 2017-06-20 |
| 9659899 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Nitin A. Deshpande +2 more | 2017-05-23 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar | 2017-03-28 |