Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793244 | Scalable package architecture and associated techniques and configurations | Sanka Ganesan, Nitesh Nimkar | 2017-10-17 |
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Eric J. Li, Debendra Mallik | 2017-08-22 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Yoshihiro Tomita | 2017-02-21 |