Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842832 | High density interconnection of microelectronic devices | John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2017-12-12 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, John S. Guzek, Ravi Mahajan +8 more | 2017-11-14 |
| 9795038 | Electronic package design that facilitates shipping the electronic package | Nitin A. Deshpande, Nachiket R. Raravikar | 2017-10-17 |
| 9754890 | Embedded multi-device bridge with through-bridge conductive via signal connection | Nitin A. Deshpande | 2017-09-05 |
| 9741692 | Methods to form high density through-mold interconnections | Nitin A. Deshpande, Edvin Cetegen, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| 9716067 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2017-07-25 |
| 9685421 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Ravindranath V. Mahajan, Nitin A. Deshpande | 2017-06-20 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2017-06-20 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li | 2017-03-28 |
| 9607947 | Reliable microstrip routing for electronics components | Nevin Altunyurt, Kyu Oh Lee, Krishna Bharath | 2017-03-28 |
| 9583470 | Electronic device with solder pads including projections | Nitin A. Deshpande | 2017-02-28 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2017-02-21 |