| 9842832 |
High density interconnection of microelectronic devices |
John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more |
2017-12-12 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, John S. Guzek, Ravi Mahajan +8 more |
2017-11-14 |
| 9795038 |
Electronic package design that facilitates shipping the electronic package |
Nitin A. Deshpande, Nachiket R. Raravikar |
2017-10-17 |
| 9754890 |
Embedded multi-device bridge with through-bridge conductive via signal connection |
Nitin A. Deshpande |
2017-09-05 |
| 9741692 |
Methods to form high density through-mold interconnections |
Nitin A. Deshpande, Edvin Cetegen, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh |
2017-08-22 |
| 9716067 |
Integrated circuit package with embedded bridge |
Ravindranath V. Mahajan, Christopher J. Nelson, Feras Eid, Nitin A. Deshpande, Shawna M. Liff |
2017-07-25 |
| 9685421 |
Methods for high precision microelectronic die integration |
Aleksandar Aleksov, Ravindranath V. Mahajan, Nitin A. Deshpande |
2017-06-20 |
| 9685388 |
Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Jiro Kubota, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande |
2017-06-20 |
| 9607964 |
Method and materials for warpage thermal and interconnect solutions |
Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li |
2017-03-28 |
| 9607947 |
Reliable microstrip routing for electronics components |
Nevin Altunyurt, Kyu Oh Lee, Krishna Bharath |
2017-03-28 |
| 9583470 |
Electronic device with solder pads including projections |
Nitin A. Deshpande |
2017-02-28 |
| 9576942 |
Integrated circuit assembly that includes stacked dice |
Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita |
2017-02-21 |