Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2017-12-12 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Omkar G. Karhade, John S. Guzek, Ravi Mahajan +8 more | 2017-11-14 |
| 9666549 | Methods for solder for through-mold interconnect | Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Robert M. Nickerson | 2017-05-30 |
| 9617148 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Min Tao, Edward Zarbock | 2017-04-11 |