Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Zhuowen Sun, Hoki Kim, Wael Zohni, Akash Agrawal | 2017-08-08 |
| 9691728 | BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility | Robert M. Nickerson, John S. Guzek | 2017-06-27 |
| 9617148 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Charles A. Gealer, Edward Zarbock | 2017-04-11 |