Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812402 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2017-11-07 |
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Hoki Kim, Wael Zohni, Akash Agrawal | 2017-08-08 |
| 9691437 | Compact microelectronic assembly having reduced spacing between controller and memory packages | Yong-Syuan Chen | 2017-06-27 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2017-06-27 |
| 9679613 | TFD I/O partition for high-speed, high-density applications | Kyong-Mo Bang, Belgacem Haba, Wael Zohni | 2017-06-13 |
| 9666521 | Ultra high performance interposer | Cyprian Emeka Uzoh | 2017-05-30 |
| 9640282 | Flexible I/O partition of multi-die memory solution | Yong-Syuan Chen | 2017-05-02 |
| 9640236 | Reduced load memory module using wire bonds and a plurality of rank signals | Yong-Syuan Chen | 2017-05-02 |
| 9595511 | Microelectronic packages and assemblies with improved flyby signaling operation | Belgacem Haba, Javier A. Delacruz | 2017-03-14 |
| 9583417 | Via structure for signal equalization | Cyprian Emeka Uzoh, Yong-Syuan Chen | 2017-02-28 |