Issued Patents 2017
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831302 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2017-11-28 |
| 9825002 | Flipped die stack | Rajesh Katkar, Reynaldo Co, Scott McGrath, Ashok S. Prabhu, Sangil Lee +1 more | 2017-11-21 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-11-21 |
| 9812406 | Microelectronic assemblies with cavities, and methods of fabrication | Liang Wang, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2017-11-07 |
| 9754866 | Reversed build-up substrate for 2.5D | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2017-09-05 |
| 9755592 | Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods | Peter J. Zampardi, Jr., Hsiang-Chih Sun, Mehran Janani, Jens Albrecht Riege | 2017-09-05 |
| 9741620 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Arkalgud R. Sitaram | 2017-08-22 |
| 9741649 | Integrated interposer solutions for 2D and 3D IC packaging | Charles G. Woychik, Arkalgud R. Sitaram, Guilian Gao | 2017-08-22 |
| 9691696 | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication | Liang Wang, Rajesh Katkar | 2017-06-27 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2017-06-27 |
| 9666559 | Multichip modules and methods of fabrication | Liang Wang, Rajesh Katkar | 2017-05-30 |
| 9666560 | Multi-chip microelectronic assembly with built-up fine-patterned circuit structure | Liang Wang, Guilian Gao, Rajesh Katkar, Belgacem Haba | 2017-05-30 |
| 9666508 | Gallium arsenide devices with copper backside for direct die solder attach | — | 2017-05-30 |
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2017-02-28 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-01-17 |
| 9536862 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2017-01-03 |