Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Bongsub Lee, Gabriel Z. Guevara +3 more | 2017-12-19 |
| 9769923 | Interposers | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Arkalgud R. Sitaram | 2017-09-19 |
| 9691679 | Method for package-on-package assembly with wire bonds to encapsulation surface | Reynaldo Co | 2017-06-27 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Bongsub Lee, Gabriel Z. Guevara +3 more | 2017-05-09 |
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh | 2017-02-28 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Arkalgud R. Sitaram | 2017-02-14 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Akash Agrawal, Kyong-Mo Bang +3 more | 2017-01-10 |