BL

Bong-Sub Lee

IN Invensas: 2 patents #30 of 75Top 40%
Overall (2017): #167,503 of 506,227Top 35%
2
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9769923 Interposers Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram 2017-09-19
9570385 Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram 2017-02-14