Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Liang Wang +2 more | 2017-11-21 |
| 9769923 | Interposers | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi | 2017-09-19 |
| 9741620 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Hong Shen | 2017-08-22 |
| 9741649 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Guilian Gao | 2017-08-22 |
| 9741696 | Thermal vias disposed in a substrate proximate to a well thereof | Rajesh Katkar, Cyprian Emeka Uzoh | 2017-08-22 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2017-06-27 |
| 9685420 | Localized sealing of interconnect structures in small gaps | Rajesh Katkar, Cyprian Emeka Uzoh | 2017-06-20 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi | 2017-02-14 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Liang Wang +2 more | 2017-01-17 |
| 9536862 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Hong Shen, Charles G. Woychik | 2017-01-03 |