Issued Patents 2017
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852969 | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects | Rajesh Katkar | 2017-12-26 |
| 9853004 | Interconnections for a substrate associated with a backside reveal | — | 2017-12-26 |
| 9853000 | Warpage reduction in structures with electrical circuitry | — | 2017-12-26 |
| 9842819 | Tall and fine pitch interconnects | Rajesh Katkar | 2017-12-12 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-11-21 |
| 9818713 | Structures and methods for low temperature bonding using nanoparticles | — | 2017-11-14 |
| 9812360 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2017-11-07 |
| 9799626 | Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers | Rajesh Katkar | 2017-10-24 |
| 9793198 | Conductive connections, structures with such connections, and methods of manufacture | Rajesh Katkar | 2017-10-17 |
| 9780042 | Tunable composite interposer | Charles G. Woychik, Hiroaki Sato | 2017-10-03 |
| 9769923 | Interposers | Bong-Sub Lee, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-09-19 |
| 9761517 | Porous alumina templates for electronic packages | Rajesh Katkar, Belgacem Haba, Ilyas Mohammed | 2017-09-12 |
| 9754866 | Reversed build-up substrate for 2.5D | Liang Wang, Rajesh Katkar, Hong Shen, Belgacem Haba | 2017-09-05 |
| 9741620 | Structures and methods for reliable packages | Guilian Gao, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2017-08-22 |
| 9741696 | Thermal vias disposed in a substrate proximate to a well thereof | Rajesh Katkar, Arkalgud R. Sitaram | 2017-08-22 |
| 9728527 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2017-08-08 |
| 9711401 | Reliable packaging and interconnect structures | Belgacem Haba, Craig Mitchell | 2017-07-18 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2017-06-27 |
| 9685401 | Structures for heat dissipating interposers | Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2017-06-20 |
| 9685420 | Localized sealing of interconnect structures in small gaps | Rajesh Katkar, Arkalgud R. Sitaram | 2017-06-20 |
| 9673124 | Device and method for localized underfill | Liang Wang, Rajesh Katkar, Charles G. Woychik | 2017-06-06 |
| 9666521 | Ultra high performance interposer | Zhuowen Sun | 2017-05-30 |
| 9666514 | High performance compliant substrate | Rajesh Katkar | 2017-05-30 |
| 9659858 | Low-stress vias | Ilyas Mohammed, Belgacem Haba | 2017-05-23 |
| 9646917 | Low CTE component with wire bond interconnects | Rajesh Katkar | 2017-05-09 |