| 9847277 |
Staged via formation from both sides of chip |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2017-12-19 |
| 9711401 |
Reliable packaging and interconnect structures |
Cyprian Emeka Uzoh, Belgacem Haba |
2017-07-18 |
| 9659812 |
Microelectronic elements with post-assembly planarization |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2017-05-23 |
| 9640437 |
Methods of forming semiconductor elements using micro-abrasive particle stream |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2017-05-02 |
| 9634412 |
Connector structures and methods |
Cyprian Emeka Uzoh |
2017-04-25 |
| 9620437 |
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip |
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia |
2017-04-11 |
| 9570416 |
Stacked packaging improvements |
Belgacem Haba, Masud Beroz |
2017-02-14 |
| 9560773 |
Electrical barrier layers |
Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia |
2017-01-31 |