Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847277 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2017-12-19 |
| 9659812 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2017-05-23 |
| 9640437 | Methods of forming semiconductor elements using micro-abrasive particle stream | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2017-05-02 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2017-04-11 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Craig Mitchell | 2017-01-31 |