Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853079 | Method of forming a stress released image sensor package structure | Zhenhua Lu | 2017-12-26 |
| 9847277 | Staged via formation from both sides of chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2017-12-19 |
| 9812360 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2017-11-07 |
| 9666625 | Method of making low profile sensor package with cooling feature | Zhenhua Lu | 2017-05-30 |
| 9667900 | Three dimensional system-on-chip image sensor package | Zhenhua Lu | 2017-05-30 |
| 9666730 | Wire bond sensor package | Zhenhua Lu | 2017-05-30 |
| 9659812 | Microelectronic elements with post-assembly planarization | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2017-05-23 |
| 9640437 | Methods of forming semiconductor elements using micro-abrasive particle stream | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2017-05-02 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2017-04-11 |
| 9570634 | Sensor package with exposed sensor array and method of making same | Zhenhua Lu | 2017-02-14 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Ilyas Mohammed, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2017-01-31 |
| 9558998 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2017-01-31 |
| 9548254 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Charles Rosenstein | 2017-01-17 |
| 9543347 | Stress released image sensor package structure and method | Zhenhua Lu | 2017-01-10 |