Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853079 | Method of forming a stress released image sensor package structure | Vage Oganesian | 2017-12-26 |
| 9666625 | Method of making low profile sensor package with cooling feature | Vage Oganesian | 2017-05-30 |
| 9666730 | Wire bond sensor package | Vage Oganesian | 2017-05-30 |
| 9667900 | Three dimensional system-on-chip image sensor package | Vage Oganesian | 2017-05-30 |
| 9570634 | Sensor package with exposed sensor array and method of making same | Vage Oganesian | 2017-02-14 |
| 9543347 | Stress released image sensor package structure and method | Vage Oganesian | 2017-01-10 |