Issued Patents 2017
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633971 | Structures and methods for low temperature bonding using nanoparticles | — | 2017-04-25 |
| 9634412 | Connector structures and methods | Craig Mitchell | 2017-04-25 |
| 9615451 | Porous alumina templates for electronic packages | Rajesh Katkar, Belgacem Haba, Ilyas Mohammed | 2017-04-04 |
| 9607928 | Method and structures for via substrate repair and assembly | — | 2017-03-28 |
| 9601467 | Microelectronic package with horizontal and vertical interconnections | Rajesh Katkar | 2017-03-21 |
| 9601398 | Thin wafer handling and known good die test method | Charles G. Woychik, Se Young Yang, Pezhman Monadgemi, Terrence Caskey | 2017-03-21 |
| 9583417 | Via structure for signal equalization | Zhuowen Sun, Yong-Syuan Chen | 2017-02-28 |
| 9583456 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2017-02-28 |
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Laura Wills Mirkarimi | 2017-02-28 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Bong-Sub Lee, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-02-14 |
| 9558964 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Michael Newman, Terrence Caskey | 2017-01-31 |
| 9560773 | Electrical barrier layers | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2017-01-31 |
| 9558998 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2017-01-31 |
| 9551083 | Paddle for materials processing | — | 2017-01-24 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-01-17 |