Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang | 2017-09-12 |
| 9659907 | Double side mounting memory integration in thin low warpage fanout package | Jun Zhai, Kunzhong Hu, Chonghua Zhong, Mengzhi Pang | 2017-05-23 |
| 9633974 | System in package fan out stacking architecture and process flow | Jun Zhai, Kunzhong Hu, Kwan-Yu Lai, Mengzhi Pang, Chonghua Zhong | 2017-04-25 |
| 9601398 | Thin wafer handling and known good die test method | Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey, Cyprian Emeka Uzoh | 2017-03-21 |