Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9659848 | Stiffened wires for offset BVA | Grant Villavicencio, Sangil Lee, Javier A. Delacruz, Scott McGrath | 2017-05-23 |
| 9601454 | Method of forming a component having wire bonds and a stiffening layer | Zhijun Zhao | 2017-03-21 |