Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang | 2017-09-12 |
| 9716075 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda +3 more | 2017-07-25 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more | 2017-06-27 |