Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761558 | Package-on-package assembly with wire bond vias | Reynaldo Co, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2017-06-27 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Reynaldo Co | 2017-04-04 |