Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more | 2017-06-27 |
| 9633968 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Wael Zohni | 2017-04-25 |