Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812402 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2017-11-07 |
| 9806017 | Flip-chip, face-up and face-down centerbond memory wirebond assemblies | Belgacem Haba, Richard Dewitt Crisp | 2017-10-31 |
| 9761554 | Ball bonding metal wire bond wires to metal pads | Willmar Subido, Reynaldo Co, Ashok S. Prabhu | 2017-09-12 |
| 9735084 | Bond via array for thermal conductivity | Rajesh Katkar, Guilian Gao, Charles G. Woychik | 2017-08-15 |
| 9735093 | Stacked chip-on-board module with edge connector | Belgacem Haba | 2017-08-15 |
| 9728495 | Reconfigurable PoP | Belgacem Haba, Richard Dewitt Crisp | 2017-08-08 |
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Zhuowen Sun, Hoki Kim, Akash Agrawal | 2017-08-08 |
| 9679876 | Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2017-06-13 |
| 9679838 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2017-06-13 |
| 9679613 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Kyong-Mo Bang, Belgacem Haba | 2017-06-13 |
| 9640515 | Multiple die stacking for two or more die | Belgacem Haba | 2017-05-02 |
| 9633975 | Multi-die wirebond packages with elongated windows | Belgacem Haba | 2017-04-25 |
| 9633968 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Philip R. Osborn | 2017-04-25 |