Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825002 | Flipped die stack | Rajesh Katkar, Reynaldo Co, Scott McGrath, Sangil Lee, Liang Wang +1 more | 2017-11-21 |
| 9812402 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2017-11-07 |
| 9761554 | Ball bonding metal wire bond wires to metal pads | Willmar Subido, Reynaldo Co, Wael Zohni | 2017-09-12 |
| 9666513 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Rajesh Katkar, Sean MORAN | 2017-05-30 |