Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825002 | Flipped die stack | Rajesh Katkar, Scott McGrath, Ashok S. Prabhu, Sangil Lee, Liang Wang +1 more | 2017-11-21 |
| 9761554 | Ball bonding metal wire bond wires to metal pads | Willmar Subido, Wael Zohni, Ashok S. Prabhu | 2017-09-12 |
| 9761558 | Package-on-package assembly with wire bond vias | Ellis Chau, Roseann Alatorre, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2017-09-12 |
| 9691679 | Method for package-on-package assembly with wire bonds to encapsulation surface | Laura Wills Mirkarimi | 2017-06-27 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Terrence Caskey, Ellis Chau | 2017-04-04 |