Issued Patents 2017
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832887 | Micro mechanical anchor for 3D architecture | Ilyas Mohammed, Belgacem Haba | 2017-11-28 |
| 9831302 | Making electrical components in handle wafers of integrated circuit packages | Hong Shen, Rajesh Katkar | 2017-11-28 |
| 9825002 | Flipped die stack | Rajesh Katkar, Reynaldo Co, Scott McGrath, Ashok S. Prabhu, Sangil Lee +1 more | 2017-11-21 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-11-21 |
| 9812406 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2017-11-07 |
| 9812433 | Batch process fabrication of package-on-package microelectronic assemblies | Belgacem Haba, Ilyas Mohammed | 2017-11-07 |
| 9766537 | Mask | Deshuai Wang | 2017-09-19 |
| 9769923 | Interposers | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-09-19 |
| 9754866 | Reversed build-up substrate for 2.5D | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh, Belgacem Haba | 2017-09-05 |
| 9741620 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Hong Shen, Arkalgud R. Sitaram | 2017-08-22 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2017-06-27 |
| 9691696 | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication | Hong Shen, Rajesh Katkar | 2017-06-27 |
| 9673124 | Device and method for localized underfill | Rajesh Katkar, Charles G. Woychik, Cyprian Emeka Uzoh | 2017-06-06 |
| 9666560 | Multi-chip microelectronic assembly with built-up fine-patterned circuit structure | Guilian Gao, Hong Shen, Rajesh Katkar, Belgacem Haba | 2017-05-30 |
| 9666559 | Multichip modules and methods of fabrication | Rajesh Katkar, Hong Shen | 2017-05-30 |
| 9620436 | Light emitting diode device with reconstituted LED components on substrate | Eric Tosaya | 2017-04-11 |
| 9583671 | Quantum efficiency of multiple quantum wells | Ilyas Mohammed, Masud Beroz | 2017-02-28 |
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Hong Shen, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2017-02-28 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-02-14 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-01-17 |