Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-11-21 |
| 9818668 | Thermal vias disposed in a substrate without a liner layer | — | 2017-11-14 |
| 9812406 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Rajesh Katkar, Charles G. Woychik | 2017-11-07 |
| 9741620 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2017-08-22 |
| 9741649 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2017-08-22 |
| 9735084 | Bond via array for thermal conductivity | Rajesh Katkar, Charles G. Woychik, Wael Zohni | 2017-08-15 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2017-06-27 |
| 9666560 | Multi-chip microelectronic assembly with built-up fine-patterned circuit structure | Liang Wang, Hong Shen, Rajesh Katkar, Belgacem Haba | 2017-05-30 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-01-17 |