Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666513 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Ashok S. Prabhu, Rajesh Katkar | 2017-05-30 |
| 9541817 | Device and method for the transfer of patterns to an object | — | 2017-01-10 |