Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-12-19 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-11-21 |
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Zhuowen Sun, Hoki Kim, Wael Zohni | 2017-08-08 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-05-09 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-01-17 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Kyong-Mo Bang +3 more | 2017-01-10 |