Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Gabriel Z. Guevara +3 more | 2017-12-19 |
| 9817050 | Detection of welded contactor using ac coupling | Phillip John Weicker, Anil Paryani, Caio D. Gubel | 2017-11-14 |
| 9783078 | Systems and methods for disengaging a battery | Michael Hong, Phillip John Weicker, Anil Paryani | 2017-10-10 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Gabriel Z. Guevara +3 more | 2017-05-09 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal +3 more | 2017-01-10 |