Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847238 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-12-19 |
| 9679613 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Belgacem Haba, Wael Zohni | 2017-06-13 |
| 9646946 | Fan-out wafer-level packaging using metal foil lamination | Xuan Li, Rajesh Katkar, Long Huynh, Laura Wills Mirkarimi, Bongsub Lee +3 more | 2017-05-09 |
| 9543277 | Wafer level packages with mechanically decoupled fan-in and fan-out areas | Bongsub Lee, Tu Tam Vu, Rajesh Katkar, Laura Wills Mirkarimi, Akash Agrawal +3 more | 2017-01-10 |