Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Zhuowen Sun, Wael Zohni, Akash Agrawal | 2017-08-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Zhuowen Sun, Wael Zohni, Akash Agrawal | 2017-08-08 |