Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716075 | Semiconductor chip assembly and method for making same | Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda +3 more | 2017-07-25 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2017-06-27 |