Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786611 | Method for manufacturing a semiconductor package | Yasuyuki TAKEHARA | 2017-10-10 |
| 9716075 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Yoshikuni Nakadaira, Norihito Masuda +3 more | 2017-07-25 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2017-06-27 |