| 9847284 |
Stacked wafer DDR package |
— |
2017-12-19 |
$103,286,000 |
| 9748227 |
Dual-sided silicon integrated passive devices |
Vidhya Ramachandran, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong |
2017-08-29 |
$75,964,000 |
| 9728481 |
System with a high power chip and a low power chip having low interconnect parasitics |
Abraham Yee, Joe Greco, Joseph Minacapelli, John Chen |
2017-08-08 |
$198,423,000 |
| 9691701 |
SOC with integrated voltage regulator using preformed MIM capacitor wafer |
Kunzhong Hu |
2017-06-27 |
$77,923,000 |
| 9679187 |
Finger biometric sensor assembly including direct bonding interface and related methods |
Milind S. Bhagavat, Patrick E. O'Brien, Dale R. Setlak, David D. Coons, Kwan-Yu Lai |
2017-06-13 |
$53,900,000 |
| 9679801 |
Dual molded stack TSV package |
Kwan-Yu Lai, Kunzhong Hu, Flynn Carson |
2017-06-13 |
$53,900,000 |
| 9659907 |
Double side mounting memory integration in thin low warpage fanout package |
Kunzhong Hu, Chonghua Zhong, Mengzhi Pang, Se Young Yang |
2017-05-23 |
$78,322,000 |
| 9661411 |
Integrated MEMS microphone and vibration sensor |
Caleb C. Han, Tongbi Jiang |
2017-05-23 |
$78,322,000 |
| 9633974 |
System in package fan out stacking architecture and process flow |
Kunzhong Hu, Kwan-Yu Lai, Mengzhi Pang, Chonghua Zhong, Se Young Yang |
2017-04-25 |
$59,408,000 |
| 9624093 |
Method and apparatus of making MEMS packages |
Tongbi Jiang |
2017-04-18 |
$63,955,000 |
| 9601471 |
Three layer stack structure |
Kunzhong Hu |
2017-03-21 |
$48,833,000 |
| 9595526 |
Multi-die fine grain integrated voltage regulation |
Jared L. Zerbe, Emerson S. Fang, Shawn Searles |
2017-03-14 |
$102,198,000 |
| 9595514 |
Package with SoC and integrated memory |
John Bruno, Timothy J. Millet |
2017-03-14 |
$102,198,000 |
| 9589936 |
3D integration of fanout wafer level packages |
Kunzhong Hu, Flynn Carson |
2017-03-07 |
$87,942,000 |
| 9583472 |
Fan out system in package and method for forming the same |
Chih-Ming Chung, Yizhang Yang |
2017-02-28 |
$61,357,000 |
| 9574959 |
Various stress free sensor packages using wafer level supporting die and air gap technique |
Caleb C. Han, Tongbi Jiang |
2017-02-21 |
$62,812,000 |
| 9570367 |
Ultra fine pitch PoP coreless package |
Jun Chung Hsu |
2017-02-14 |
$78,066,000 |
| 9559081 |
Independent 3D stacking |
Kwan-Yu Lai, Kunzhong Hu |
2017-01-31 |
$77,222,000 |
| 9548288 |
Integrated circuit die decoupling system with reduced inductance |
Vidhya Ramachandran, Chonghua Zhong, Shawn Searles, Young Doo Jeon, Huabo Chen |
2017-01-17 |
$90,030,000 |
