Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850127 | Method and system for CMOS based MEMS bump stop contact damage prevention | Richard Yeh, Henry H. Yang | 2017-12-26 |
| 9751756 | Method and system for CMOS based MEMS bump stop contact damage prevention | Richard Yeh, Henry H. Yang | 2017-09-05 |
| 9679187 | Finger biometric sensor assembly including direct bonding interface and related methods | Patrick E. O'Brien, Jun Zhai, Dale R. Setlak, David D. Coons, Kwan-Yu Lai | 2017-06-13 |