Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9679187 | Finger biometric sensor assembly including direct bonding interface and related methods | Milind S. Bhagavat, Jun Zhai, Dale R. Setlak, David D. Coons, Kwan-Yu Lai | 2017-06-13 | $53,900,000 |