Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9721903 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin | 2017-08-01 | $97,661,000 |
| 9633953 | Methodology to achieve zero warpage for IC package | Jie Zhao | 2017-04-25 | $59,408,000 |
| 9570367 | Ultra fine pitch PoP coreless package | Jun Zhai | 2017-02-14 | $78,066,000 |