Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721903 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Shakti Singh Chauhan, Flynn Carson, Tha-An Lin | 2017-08-01 |
| 9633953 | Methodology to achieve zero warpage for IC package | Jie Zhao | 2017-04-25 |
| 9570367 | Ultra fine pitch PoP coreless package | Jun Zhai | 2017-02-14 |