Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806051 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2017-10-31 |
| 9721903 | Vertical interconnects for self shielded system in package (SiP) modules | Meng Chi Lee, Flynn Carson, Jun Chung Hsu, Tha-An Lin | 2017-08-01 |
| 9704788 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Paul Alan McConnelee | 2017-07-11 |
| 9615486 | Thermal interface devices | Hendrik Pieter Jacobus de Bock, Jay Todd Labhart, Graham Charles Kirk, Joo-Han Kim | 2017-04-04 |
| 9534855 | High specific area composite foam and an associated method of fabrication | Kaustubh Ravindra Nagarkar, Matthew Jeremiah Misner, Faisal R. Ahmad | 2017-01-03 |