Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847236 | Electrical interconnect structure for an embedded electronics package | Arun Virupaksha Gowda | 2017-12-19 |
| 9806051 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2017-10-31 |
| 9704788 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2017-07-11 |
| 9679837 | Electrical interconnect for an integrated circuit package and method of making same | Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2017-06-13 |
| 9653438 | Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda | 2017-05-16 |
| 9613932 | Integrated circuit package and method of making same | Arun Virupaksha Gowda | 2017-04-04 |
| 9613843 | Power overlay structure having wirebonds and method of manufacturing same | Arun Virupaksha Gowda | 2017-04-04 |
| 9570376 | Electrical interconnect for an integrated circuit package and method of making same | Arun Virupaksha Gowda, Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2017-02-14 |