Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748227 | Dual-sided silicon integrated passive devices | Jun Zhai, Vidhya Ramachandran, Kunzhong Hu, Mengzhi Pang | 2017-08-29 |
| 9659907 | Double side mounting memory integration in thin low warpage fanout package | Jun Zhai, Kunzhong Hu, Mengzhi Pang, Se Young Yang | 2017-05-23 |
| 9633974 | System in package fan out stacking architecture and process flow | Jun Zhai, Kunzhong Hu, Kwan-Yu Lai, Mengzhi Pang, Se Young Yang | 2017-04-25 |
| 9548288 | Integrated circuit die decoupling system with reduced inductance | Vidhya Ramachandran, Shawn Searles, Jun Zhai, Young Doo Jeon, Huabo Chen | 2017-01-17 |