Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754924 | Fan-out pop stacking process | — | 2017-09-05 |
| 9601464 | Thermally enhanced package-on-package structure | — | 2017-03-21 |
| 9583472 | Fan out system in package and method for forming the same | Jun Zhai, Yizhang Yang | 2017-02-28 |