Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735539 | VCSEL structure with embedded heat sink | Weiping Li, Xiaofeng Fan | 2017-08-15 |
| 9656856 | Method of lower profile MEMS package with stress isolations | Jie Zhao, Peter Hartwell | 2017-05-23 |
| 9661411 | Integrated MEMS microphone and vibration sensor | Caleb C. Han, Jun Zhai | 2017-05-23 |
| 9624093 | Method and apparatus of making MEMS packages | Jun Zhai | 2017-04-18 |
| 9574959 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Jun Zhai | 2017-02-21 |