Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9661411 | Integrated MEMS microphone and vibration sensor | Jun Zhai, Tongbi Jiang | 2017-05-23 | $78,322,000 |
| 9574959 | Various stress free sensor packages using wafer level supporting die and air gap technique | Tongbi Jiang, Jun Zhai | 2017-02-21 | $62,812,000 |