Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9661411 | Integrated MEMS microphone and vibration sensor | Jun Zhai, Tongbi Jiang | 2017-05-23 |
| 9574959 | Various stress free sensor packages using wafer level supporting die and air gap technique | Tongbi Jiang, Jun Zhai | 2017-02-21 |