Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691693 | Carrier-less silicon interposer using photo patterned polymer as substrate | Andrew Cao | 2017-06-27 |
| 9685401 | Structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2017-06-20 |
| 9558964 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Cyprian Emeka Uzoh, Terrence Caskey | 2017-01-31 |