| 9842832 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, John S. Guzek, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more |
2017-12-12 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more |
2017-11-14 |
| 9800015 |
Optical interconnect on bumpless build-up layer package |
Feras Eid, Weng Hong Teh |
2017-10-24 |
| 9793201 |
Glass clad microelectronic substrate |
Qing Ma |
2017-10-17 |
| 9735893 |
Patch system for in-situ therapeutic treatment |
Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Amit S. Baxi +3 more |
2017-08-15 |
| 9711428 |
Dual-sided die packages |
Henning Braunisch, Feras Eid, Adel A. Elsherbini, Don Nelson |
2017-07-18 |
| 9691579 |
Package MEMS switch and method |
Qing Ma, Valluri Rao, Feras Eid |
2017-06-27 |
| 9686861 |
Glass core substrate for integrated circuit devices and methods of making the same |
Qing Ma, Quan Tran, Robert L. Sankman, Valluri Rao |
2017-06-20 |
| 9647636 |
Piezoelectric package-integrated delay lines for radio frequency identification tags |
Adel A. Elsherbini, Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Georgios Dogiamis +1 more |
2017-05-09 |
| 9642248 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov |
2017-05-02 |
| 9635764 |
Integrated circuit and method that utilize a shape memory material |
Shipeng Qiu, Shawna M. Liff, Kayleen L. E. Helms, Joshua D. Heppner, Adel A. Elsherbini +1 more |
2017-04-25 |
| 9617148 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Qing Ma, Min Tao, Charles A. Gealer, Edward Zarbock |
2017-04-11 |
| 9601406 |
Copper nanorod-based thermal interface material (TIM) |
Chandra Mohan Jha, Feras Eid, Ashish Gupta |
2017-03-21 |
| 9591758 |
Flexible electronic system with wire bonds |
Aleksandar Aleksov, Mauro J. Kobrinsky, Rajendra C. Dias |
2017-03-07 |
| 9564408 |
Space transformer |
Aleksandar Aleksov |
2017-02-07 |