Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2017-12-12 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9800015 | Optical interconnect on bumpless build-up layer package | Johanna M. Swan, Weng Hong Teh | 2017-10-24 |
| 9791470 | Magnet placement for integrated sensor packages | Sasha N. Oster, Kyu Oh Lee, Sarah Haney | 2017-10-17 |
| 9788581 | Textile that includes an electronic system | Aleksandar Aleksov, Adel A. Elsherbini, Sasha N. Oster, Braxton Lathrop, Nadine L. Dabby | 2017-10-17 |
| 9735893 | Patch system for in-situ therapeutic treatment | Aleksandar Aleksov, Sasha N. Oster, Adel A. Elsherbini, Johanna M. Swan, Amit S. Baxi +3 more | 2017-08-15 |
| 9716067 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Nitin A. Deshpande, Shawna M. Liff | 2017-07-25 |
| 9711428 | Dual-sided die packages | Henning Braunisch, Adel A. Elsherbini, Johanna M. Swan, Don Nelson | 2017-07-18 |
| 9691579 | Package MEMS switch and method | Qing Ma, Johanna M. Swan, Valluri Rao | 2017-06-27 |
| 9674945 | Heterogeneous integration of microfluidic devices in package structures | Weng Hong Teh, Kevin Lin, Qing Ma | 2017-06-06 |
| 9647636 | Piezoelectric package-integrated delay lines for radio frequency identification tags | Adel A. Elsherbini, Telesphor Kamgaing, Vijay K. Nair, Georgios Dogiamis, Johanna M. Swan +1 more | 2017-05-09 |
| 9601406 | Copper nanorod-based thermal interface material (TIM) | Chandra Mohan Jha, Johanna M. Swan, Ashish Gupta | 2017-03-21 |
| 9559037 | Package integrated synthetic jet device | Jessica Gullbrand, Melissa A. Cowan | 2017-01-31 |