Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, M. Clair Webb, Kimin Jun, Il-Seok Son | 2017-08-01 |
| 9711428 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Johanna M. Swan | 2017-07-18 |