Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9835648 | Liquid metal interconnects | Rajashree Baskaran, Ting Zhong, Roy E. Swart, Paul B. Fischer | 2017-12-05 | $17,379,000 |
| 9818751 | Methods of forming buried vertical capacitors and structures formed thereby | Rajashree Baskaran, Patrick Morrow | 2017-11-14 | $11,178,000 |
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, M. Clair Webb, Il-Seok Son | 2017-08-01 | $11,137,000 |
| 9685436 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, M. Clair Webb, Donald W. Nelson | 2017-06-20 | $9,273,000 |
| 9646972 | Methods of forming buried vertical capacitors and structures formed thereby | Rajashree Baskaran, Patrick Morrow | 2017-05-09 | $10,144,000 |
| 9590051 | Heterogeneous layer device | Patrick Morrow | 2017-03-07 | $9,849,000 |
| 9548320 | Heterogeneous semiconductor material integration techniques | Alejandro X. Levander | 2017-01-17 | $15,866,000 |