Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9835648 | Liquid metal interconnects | Rajashree Baskaran, Kimin Jun, Ting Zhong, Roy E. Swart | 2017-12-05 |
| 9786559 | Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs) | Paul A. Zimmerman, Scott B. Clendenning, Patricio E. Romero, Robert Edgeworth | 2017-10-10 |