Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786559 | Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs) | Paul A. Zimmerman, Scott B. Clendenning, Patricio E. Romero, Paul B. Fischer | 2017-10-10 |